IEEE ICCE 2026

COUNTDOWN

IEEE ICCE 2026

July 29th-31st, 2026

Sheraton Nha Trang Hotel & Spa, Nha Trang City, Khanh Hoa Province, Vietnam

IEEE ICCE 2026

IMPORTANT DATES

May 03rd, 2026	Acceptance notification
May 15th, 2026	Camera ready
May 29th, 2026	Early bird registration
July 29th-31st, 2026	Conference date

The 11^th IEEE ICCE 2026 is a prestigious event for researchers, experts, and companies to exchange and share their state-of-the-art research results in the field of Communication and Electronic Engineering. The three-day conference, held in Nha Trang City on July 29^th - July 31^st, 2026, will feature inspiring keynote talks delivered by world-class researchers, technical sessions, tutorials, and workshops.

IEEE ICCE 2026 holds special significance, as it commemorates the 20th anniversary of the IEEE ICCE conference series and celebrates the 70th anniversary of Hanoi University of Science and Technology (HUST) — the proud host institution. These dual milestones mark two decades of excellence in advancing global research collaboration and seven decades of HUST’s leadership in science, technology, and engineering education.

SUBMISSION AND PUBLICATIONS

Prospective authors are invited to submit full papers with maximum length of 6 pages in PDF format via EDAS: https://edas.info/N34278. Paper template can be referred to at IEEE standard template.

Full accepted papers will be published in the IEEE ICCE 2026 Conference Proceedings and submitted for inclusion in IEEE Xplore®. The proceedings of ICCE series are regularly indexed by SCOPUS and listed in Conference Proceeding Citation Index (CPCI) of Clarivate.

SCOPE OF THE CONFERENCE

Contributed papers are solicited describing original works in electronics, communication engineering and related technologies. Topics and technical areas of interest include but are not limited to the following:

I. COMMUNICATION NETWORKS AND SYSTEMS

Networking: Cloud/Fog/Edge Computing; Networking for Big Data; Social Networks; Network Security; IoT and Applications; AI in Networking; Network Infrastructure for AI; Mobile & Wireless Networks; Next-Generation Networking & Internet; Paradigms & Applications; Network Softwarization; Datacenter Networking; Network Optimization and Performance; Energy-Efficiency in Network and Cloud.

Communication Systems: Modulation, coding, information theory, and communication security; MIMO, massive MIMO, and cell-free MIMO systems; mmWave, THz, and ultra-reliable low-latency communications; cognitive, cooperative, and green communications; integrated sensing and communication (ISAC); Semantic and quantum communications; RIS/IRS and stacked intelligent metasurfaces (SIM); AI- and ML-driven wireless networks, SDN, and NFV; IoT, V2X, and D2D communications; Satellite, UAV, and HAP networks; Optical, VLC, and radio-over-fiber (RoF) communications.

II. SIGNAL PROCESSING AND APPLICATIONS

Signal Processing: Signal Filtering, Detection and Estimation, Statistical Signal Processing and Modeling; Signal and Image Encryption; Multimedia Privacy, Security and Forensics; Biomedical Signal Processing and Systems; Signal Processing Fundamentals & Applications; Signal Processing in Communications.

Multimedia Processing: Image/Video Processing, Analysis and Applications; Speech, Language, and Audio.

Deep Learning and Machine Learning for Signal Processing: Machine Learning for Signal Processing; AI for Multimedia Understanding; Multimodal AI; Generative AI and LLM for Signal Processing; AI Foundations and Big Data for Signal Processing; Edge AI and Efficient ML; Human-AI Collaboration; Learned Data Coding and Processing.

V. POWER ELECTRONICS

Power Electronics Devices and Components.

Power Converter Topologies.

Converter Modelling, Design, and Control.

Power Electronics Applications: Renewable energy, EVs, smart grids, industrial drives, Energy Storage and Power Management, wireless power transfer, biomedical power electronics, aerospace, and defense systems.

III. MICROWAVE ENGINEERING

Microwave and Millimeter-Wave Devices and Components Design: Passive and Active Devices/Components, Integration Techniques, Nano-Scale Devices, Mm-Wave and THz Components.

Antenna and Propagation: Compact Antennas, Reconfigurable and Smart Antennas, Beamforming, Massive MIMO Antennas, Phased Arrays, Measurements, Channel Modeling and Propagation, and Other related topics.

EM Field Theory and Simulation Techniques: EM Theory, Modelling and Computational, Imaging, Metamaterials, Metasurfaces, Transparent Surfaces, Scattering and Diffraction, and Other EM-related topics.

Microwave and Millimeter-Wave Systems and Applications: Sensing, Radar, Localization, Intelligent and Reconfigurable Surfaces, RFID, Wireless Power Transfer, Energy Harvesting, EMC/EMI, and Other related applications.

IV. ELECTRONIC SYSTEMS

Digital, mixed-signal, analog/RF/mm-wave integrated circuits and systems.

Emerging technologies, circuits and applications including IoT, autonomous vehicles, FPGA-based and embedded systems.

EDA: System Design, Synthesis and Optimization; Formal Methods and Verification

Architectures and Systems: NoC, Multi-Core, Video and Multimedia, Embedded Systems, Reconfigurable Computing, System-Level Power Management, IoT Devices, Hardware Security, High Performance/Parallel Computing Platforms for Big Data.

Application Systems: Communication, Consumer and Multimedia; Medical and Healthcare; Spacecraft Avionics, Artificial Intelligence, Deep Learning.

SPECIAL SESSIONS

Tb be announced

Please visit https://ieee-icce.org/category/special-sessions for more details.